CVE-2017-18170: Vulnerability Analysis & Exploit Details

CVE-2017-18170 Vulnerability Summary

Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.

CVE-2017-18170: Detailed Information and External References

EPSS

0.00077

EPSS %

0.36065

References

0.00077

• https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins
• https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins

CWE

CWE-191

Vulnerable Configurations

• cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:qca9379:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:qca9379:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
• cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
  cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
• cpe:2.3:h:qualcomm:sdm710:-:*:*:*:*:*:*:*
  cpe:2.3:h:qualcomm:sdm710:-:*:*:*:*:*:*:*

CVSS3 Source

nvd@nist.gov

CVSS3 Type

Primary

CVSS3 Vector

CVSS:3.0/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H